Component carrier

ABSTRACT

The invention provides a structure and method of its use comprising a filtering and interference suppression device ( 62 ), particularly of the broad band type, for an electric motor ( 34 ) comprising at least a first powering brush ( 16 ) for an armature commutator of the electric motor ( 34 ), of the type comprising a capacitor ( 64 ), one terminal of which is electrically connected to a strip conductor ( 38 ) that electrically powers the first brush ( 16 ) powering the armature commutator of the electric motor ( 34 ), and the other terminal of which is electrically connected to a ground strip conductor ( 58 ), connected, in turn, to the electrical ground ( 60 ) of the electric motor ( 34 ), characterized in that the capacitor ( 72 ) of the filtering and interference suppression device ( 62 ) is of the non-inductive type, and in that each of the non-inductive capacitors ( 72 ) is directly attached to a circuit board ( 73 ) comprising strip conductors, of which are at least one powering strip conductor ( 38, 40 ) for a brush and one ground strip conductor ( 58 ).

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation-in-part of PCT/US99/07,653,filed Apr. 6, 1999, which was published as WO 99/52210 on Oct. 14, 1999,which is a continuation-in-part of application Ser. No. 09/056,436 filedApr. 7, 1998; and PCT/US99/07,653, filed Apr. 6, 1999, claims thebenefit of U.S. Provisional Application No. 60/101,511 filed Sep. 23,1998 and U.S. Provisional Application No. 60/103,759 filed Oct. 9, 1998.

[0002] This application also incorporates by reference the entirety ofthe disclosure of U.S. patent application publication No. 2003/0048029,which is a publication of U.S. patent application Ser. No. 10/239,983,which is a United States national stage proceeding of PCT applicationnumber PCT/FR01/00969, filed Mar. 20, 2001, entitled “Filtering andinterference suppressing device for an electric motor,” and which namesas alleged inventors DeDaran, Francois; (Chatellerault, FR); Bruneau,Severin; (Chatellerault, FR) ; Rouyer, Philippe; (Chatellerault, FR) ;Salembere, Abdou; (Chatellerault, FR).

[0003] This application also incorporates by reference the disclosure ofPCT/US99/07653, Ser. Nos. 09/056,436, 60/101,511, and 60/103,759.

BACKGROUND OF THE INVENTION FIELD OF THE INVENTION

[0004] The present invention relates to electronic component carriersused in the manufacture of electronic equipment. More specifically, theinvention relates to component carrier substrates used to protectelectronic components from mechanical stresses associated with theirhandling and coupling within electronic equipment. The component carriersubstrates also provide electrical interference shielding and improvedthermal characteristics.

DISCUSSION OF THE BACKGROUND

[0005] The majority of electronic equipment produced presently, and inparticular computers, communication systems, military surveillanceequipment, stereo and home entertainment equipment, televisions andother appliances include miniaturized components to perform new highspeed functions and electrical interconnections which according to thematerials from which they are made or their mere size are verysusceptible to stray electrical energy created by electromagneticinterference or voltage transients occurring on electrical lines.Voltage transients can severely damage or destroy such micro-electroniccomponents or contacts thereby rendering the electronic equipmentinoperative, and requiring extensive repair and/or replacement at greatcost.

[0006] Based upon the foregoing there was found a need to provide amulti-functioning electronic component architecture which attenuateselectromagnetic emissions resulting from differential and common modecurrents flowing within electronic circuits, single lines, pairs oflines and multiple twisted pairs. Such multi-functioning electroniccomponents are the subject of application Ser. No. 08/841,940,continuation-in-part application Ser. No. 09/008,769, andcontinuation-in-part application Ser. No. 09/056,379, all incorporatedherein by reference.

[0007] While the above referenced electronic components accomplish theirrespective tasks, usage of such components has been limited for a numberof reasons. First, the number of such components required continues toincrease as applications, such as data buses, continue to grow. Inaddition, as the number of required components grows, so does thephysical size of multi-component packages. Second, by their nature theelectronic components referred to are delicate structures which do nothandle physical stress well. During the manufacture of electronicproducts a number of mechanical stresses associated with handling andsoldering can damage the components.

[0008] Another drawback to using the referenced electronic components isthat it becomes very tedious to manually handle and mount the componentson electronic products being assembled. This often time translates intolower product yields and added expense due to broken or misconnectedcomponents. A further disadvantage to some of the components is thatthey include leads for thru-hole insertion. Physical stressing, bendingor applying torque to the leads can cause a failure in the finalproduct, either immediately or later thereby affecting the productsoverall reliability.

[0009] Another source of electrical noise found in prior artdifferential mode filters, common mode filters and capacitor decouplersis caused by imperfections in the capacitors that make up the filtersand decouplers. The effects of these imperfections are commonly referredto as parasitic effects. Parasitic or non-ideal capacitor behaviormanifests itself in the form of resistive and inductive elements,nonlinearity and dielectric memory. The four most common effects areleakage or parallel resistance, equivalent series resistance (ESR),equivalent series inductance (ESL) and dielectric absorption. Theequivalent series resistance (ESR) of a capacitor is the resistance ofthe capacitor leads in series with the equivalent resistance of thecapacitor plates. ESR causes the capacitor to dissipate power duringhigh flowing ac currents. The equivalent series inductance (ESL) of acapacitor is the inductance of the capacitor leads in series with theequivalent inductance of the capacitor plates. An additional form ofparasitic that goes beyond the component itself is stray capacitancewhich is attributed to the attachment of the capacitor element within anelectrical circuit. Stray capacitors are formed when two conductors arein close proximity to each other and are not shorted together orscreened by a Faraday shield. Stray capacitance usually occurs betweenparallel traces on a PC board or between traces/planes on opposite sidesof a PC board. Stray capacitance can cause problems such as increasednoise and decreased frequency response.

[0010] Several other sources of electrical noise include cross talk andground bounce.

[0011] Cross talk in most connectors or carriers is usually the resultof mutual inductance between two adjacent lines rather than fromparasitic capacitance and occurs when signal currents follow the path ofleast inductance, especially at high frequencies, and return or coupleonto nearby conductors such as conductive tracks positioned parallelwith or underneath the signal current track. Ground bounce is caused byshifts in the internal ground reference voltage due to output switchingof a component. Ground bounce causes false signals in logic inputs whena device output switches from one state to another. It has been foundthat the multi-functioning electronic components, specifically thedifferential and common mode filters and decouplers disclosed in theabove referenced, commonly owned U.S. patent applications, provideimproved performance when coupled or used with an enlarged ground shieldthat can substantially decrease or reduce and in some cases caneliminate capacitor parasitics, stray capacitance, mutual inductivecoupling between two opposing conductors, various forms of cross talkand ground bounce.

[0012] Therefore, in light of the foregoing deficiencies in the priorart, the applicant's invention is herein presented.

SUMMARY OF THE INVENTION

[0013] Based upon the foregoing, there has been found a need to providea component carrier which is less susceptible to mechanical stresses andshock, more easily assembled, surface mountable and capable of beingused in automated assembly.

[0014] It is therefore a main object of the present invention to providea component carrier for maintaining one or more surface mountcomponents.

[0015] It is another object of the present invention to provide acomponent carrier which is less susceptible to mechanical stressesimparted upon components during various manufacturing processes.

[0016] It is also an object of the present invention to provide acomponent carrier having an enhanced ground surface which improves thefunctional characteristics of surface mount components coupled to thecomponent carrier.

[0017] It is a further object of the present invention to provide acomponent carrier adapted specifically to receive a differential andcommon mode filter and decoupler as disclosed in the above referenced,commonly owned pending U.S. patent applications.

[0018] It is a further object of the present invention to provide acomponent carrier having an enhanced ground surface which improves thefunctional characteristics of differential and common mode filters anddecouplers as disclosed in the above referenced, commonly owned pendingU.S. patent applications.

[0019] It is a further object of the present invention to provide anelectrical circuit conditioning assembly that combines a componentcarrier with a differential and common mode filter and decoupler asdisclosed in the above referenced, commonly owned pending U.S. patentapplications to thereby provide simultaneous filtering of common anddifferential mode interference, suppression of parasitic or straycapacitance, mutual inductive coupling between two adjacent conductorsand circuit decoupling from a single assembly.

[0020] These and other objects and advantages of the present inventionare accomplished through the use of various embodiments of a componentcarrier which receives either a thru-hole or surface mount differentialand common mode filter and decoupler as disclosed in the abovereferenced, commonly owned pending U.S. patent applications (hereinafterreferred to only as “differential and common mode filter”).

[0021] One embodiment consists of a plate of insulating material, alsoreferred to as a planar insulator, having a plurality of apertures foraccepting the leads of a thru-hole differential and common mode filter.Another embodiment consists of a surface mount component carriercomprised of a disk of insulating material having at least twoapertures.

[0022] The disk is substantially covered by a metalized ground surfaceand includes at least two conductive pads surrounding the apertures, andinsulating bands which surround each conductive pad. The insulatingbands separate and electrically isolate the conductive pads from themetalized ground surface. A surface mount component, such as adifferential and common mode filter, is positioned lengthwise betweenthe two conductive pads and operably coupled to the carrier. Once thesurface mount component is coupled to the carrier, the combination canbe manipulated, either manually or through various types of automatedequipment, without subjecting the surface mount component to mechanicaland physical stresses normally associated with the handling of miniaturecomponents.

[0023] The carrier also provides the added benefit of improved shieldingfrom electromagnetic interference and over voltage dissipation due tothe surface area of the metalized ground surface.

[0024] The same concept for the above described carrier is alsoincorporated into several alternate embodiments, either independently,embedded within electronic connectors or configured for use withelectric motors. The overall configuration and electricalcharacteristics of the concepts underlying the present inventions arealso described as an electrical circuit conditioning assembly whichencompasses the combination of differential and common mode filters andcomponent carriers optimized for such filters.

[0025] These along with other objects and advantages of the presentinvention will become more readily apparent from a reading of thedetailed description taken in conjunction with the drawings and theclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

[0026]FIG. 1 is a perspective, exploded view of a thru-hole differentialand common mode filter coupled to a portion of the thru-hole componentcarrier of the present invention;

[0027]FIG. 2 is an elevational view in cross section of a single-sidedsurface mount component carrier of the present invention;

[0028]FIG. 3 is a top plan view of the surface mount component carriershown in FIG. 2;

[0029]FIG. 4 is an elevational view in cross section of a double-sidedsurface mount component carrier of the present invention;

[0030]FIG. 5 is a top plan view of the surface mount component carriershown in FIG. 4;

[0031]FIG. 6 is an elevational view in cross section of an alternateembodiment of a single-sided surface mount component carrier of thepresent invention;

[0032]FIG. 7 is a top plan view of the surface mount component carriershown in FIG. 6;

[0033]FIG. 8 is an elevational view in cross section of an alternateembodiment of a double-sided surface mount component carrier of thepresent invention;

[0034]FIG. 9 is a top plan view of the surface mount component carriershown in FIG. 8;

[0035]FIGS. 10A and 10B are top plan views of a surface mount componentcarrier with and without a differential and common mode filter, as shownin FIG. 10C, attached to the component carrier; FIG. 10D is a top planview of a multi surface mount component carrier with differential andcommon mode filters;

[0036]FIG. 11A is a top plan view of a multi surface mount componentcarrier with and without differential and common mode filters coupled tothe component carrier, wherein the component carrier is optimized foruse in a D-sub connector assembly; FIG. 11B is an elevational view incross section of the component carrier along lines A-A: and FIG. 11C isan elevational view in cross section of the component carrier alonglines B-B;

[0037]FIG. 12A is a top plan view of a surface mount component carrierwith a strip differential and common mode filter partially shown coupledto the component carrier, wherein the component carrier is optimized foruse in an RJ-45 connector assembly; FIG. 12B is a bottom plan view ofthe component carrier shown in FIG. 12A; and FIG. 12C is an elevationalview in cross section of the component carrier shown in FIG. 12A alonglines A-A;

[0038]FIG. 13A is a top plan view of an alternate surface mountcomponent carrier, wherein the component carrier is optimized for use inan RJ-45 connector assembly; FIG. 13B is a bottom plan view of thecomponent carrier shown in FIG. 13A; and FIG. 13C is an elevational viewin cross section of the component carrier shown in FIG. 13A along linesA-A;

[0039]FIG. 14A is a top plan view of a multi surface mount componentprototype carrier;

[0040]FIG. 14B is an elevational view in cross section of the componentcarrier shown in FIG. 14A along lines A-A; FIG. 14C is an elevationalview in cross section of the component carrier shown in FIG. 14A alonglines B-B; and FIG. 14D is a bottom plan view of the component carriershown in FIG. 14A;

[0041]FIG. 15 is a perspective view of a connector carrier of thepresent invention;

[0042]FIG. 16 is a top plan view of the connector carrier shown in FIG.15;

[0043]FIG. 17 is a perspective view of a standard connector shell;

[0044]FIG. 18 is an exploded perspective view of the connector carrierof the present invention in operable cooperation with a standardconnector shell and a multi-conductor differential and common modefilter;

[0045]FIG. 19 is a partial perspective view of a further embodiment of aconnector surface mount differential and common mode filter carrier ofthe present invention;

[0046]FIG. 20 is a partial top plan view of the connector surface mountdifferential and common mode carrier shown in FIG. 19;

[0047]FIG. 21A is a top plan view of a strain relief carrier of thepresent invention; FIG. 21B is a side elevational view in cross sectionof the strain relief carrier shown in FIG. 21A along lines A-A; FIG. 21Cis a side elevational view in cross section of the strain relief carriershown in FIG. 21A along lines B-B; FIG. 21D is a top plan view of thestrain relief carrier shown in FIG. 21A showing structural foldinglines; and FIG. 21E is a side elevational view in cross section of thestrain relief carrier shown in FIG. 21D along lines A-A which include abracket for receiving the strain relief carrier and differential andcommon mode filter mounted within the strain relief carrier;

[0048]FIG. 22A is a side elevational view of a ground strap carrier ofthe present invention; FIG. 22B is a perspective view of the groundstrap carrier including a differential and common mode filter; FIG. 22Cis a side elevational view of an alternate embodiment of the groundstrap carrier of the present invention; and FIG. 22D is a perspectiveview of the ground strap carrier shown in FIG. 22C including adifferential and common mode filter;

[0049]FIG. 23 is a side elevational view in cross section of the groundstrap carrier shown in FIGS. 22A-D in operable coupling with an electricmotor;

[0050]FIG. 24A is a top plan view of a motor filter carrier of thepresent invention; FIG. 24B is a side elevational view in cross sectionof the motor filter carrier shown in FIG. 24A; and FIG. 24C is a bottomplan view of the motor filter carrier shown in FIGS. 24A and 24B;

[0051]FIG. 25A is a bottom plan view of an alternate embodiment of themotor filter carrier of the present invention; FIG. 25B is a sideelevational view in cross section of the motor filter carrier shown inFIG. 25A along lines B-B; FIG. 25C is a top plan view of the motorfilter carrier shown in FIGS. 25A and 25B; and FIG. 25D is a sideelevational view in cross section of the motor filter carrier shown inFIG. 25C along lines A-A;

[0052]FIG. 26A is a top plan view of an alternate embodiment of themotor filter carrier of the present invention comprised of multiplelayers; FIG. 26B is a side elevational view of the motor filter carriershown in FIG. 26A; FIG. 26C is a bottom plan view of the motor filtercarrier shown in FIG. 26A; FIG. 26D is a side elevational view in crosssection of the motor filter carrier shown in FIG. 26C along lines B-B;FIG. 26E is a top plan view of an intermediate layer of the motor filtercarrier shown in FIG. 26A; and FIG. 26F is a side elevational view incross section of the motor filter carrier shown in FIG. 26E along linesC-C;

[0053]FIG. 27A is a top plan view of a carrier electrical circuitconditioning assembly of the present invention; and FIG. 27B is a sideelevational view of the carrier electrical circuit conditioning assemblyshown in FIG. 27A; and

[0054]FIG. 28A is a top plan view of a carrier electrical circuitconditioning assembly applied to a crystal base portion of a crystalcomponent; FIG. 28B is a side elevational view of the carrier electricalcircuit conditioning assembly applied to a crystal base portion of acrystal component shown in FIG. 28A; FIG. 28C is a front elevationalview of the carrier electrical circuit conditioning assembly enclosed ina crystal component application shown in FIG. 28B with a metalenclosure; and FIG. 28D is a side elevational view of the carrierelectrical circuit conditioning assembly enclosed in a crystal componentapplication shown in FIG. 28C.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0055]FIG. 1 shows the present invention in its simplest form. Componentcarrier 132 is shown coupled with a differential and common mode filter130 having thru-hole leads 140 for electrical coupling to carrier 132.Differential and common mode filter 130 is disclosed in application Ser.Nos. 08/841,940; 09/008,769; and 09/056,379, incorporated herein byreference. Briefly, the structure of differential and common mode filter130 will be described. Filter 130 consists of a first electrode 136 anda second electrode 138 which are separated by and electrically isolatedfrom a plurality of ground layers 134 and each other. The particulararchitecture creates a line-to-line capacitor and two line-to-groundcapacitors which provide for differential and common mode filtering anddecoupling.

[0056] Because filter 130 is a somewhat fragile component, componentcarrier 132 provides a physical support to which filter 130 iselectrically coupled. The first and second electrodes 136 and 138 eachhave conductive leads 140 which are inserted into apertures 148 ofconductive pads 144. Each conductive pad 144 is electrically isolatedfrom the conductive surface 142 of component carrier 132 by insulatingbands 146. Not only does component carrier 132 provide additionalphysical strength to differential and common mode filter 130 but it alsoacts as a ground shield which substantially improves the electricalcharacteristics of filter 130. When filter 130 is properly coupled tocarrier 132 the plurality of ground layers 134 are electrically coupledto one another and then coupled to conductive surface 142 by any numberof means known by those of ordinary skill in the art. One common meansof electrical coupling is through the use of solder 150 pointsconnecting portions of the ground layers 134 to conductive surface 142.One advantage to the relatively large conductive surface 142 ofcomponent carrier 132 is that if cracks 152 or electrical openings formon conductive surface 142 its shielding effect is not lost.

[0057] A more specific embodiment of the present invention illustratedin FIG. 2 is surface mount component carrier 10 for maintaining aceramic planar surface mount electrical component, such as adifferential and common mode filter as is disclosed in application Ser.Nos. 08/841,940; 09/008,769; and 09/056,379, incorporated herein byreference. Carrier 10 is a disk comprised of an insulator 14, such asceramic, having at least two apertures 18. Insulator 14 is covered by aconductive metalized ground surface 16, at least two conductive pads 24surrounding apertures 18, and insulating bands 22 surrounding eachconductive pad 24. Throughout the written description “insulator” or“insulating material” may also be referred to as “planar insulator.”Insulating bands 22 separate and electrically isolate conductive pads 24from metalized ground surface 16. In the top plan view of carrier 10,shown in FIG. 3, the preferred embodiment of the invention is circularin shape with square insulating bands 22 surrounding partially roundedconductive pads 24. Carrier 10 and its various elements can be formedinto many different shapes and Applicant does not intend to limit thescope of the invention to the particular shapes shown in the drawings.

[0058] Referring again to FIG. 2, in the preferred embodiment, metalizedground surface 16 covers a substantial portion of the top and sides ofcarrier 10. Through-hole plating 20 covers the inner walls of aperture18 and electrically couples to the corresponding conductive pad 24.Through-hole plating 20 provides greater surface area for electricalcoupling of conductors 34 to conductive pads 24 as the conductors 34 aredisposed through apertures 18. The configuration of metalized groundsurface 16, insulating bands 22 and conductive pads 24 provide thenecessary contacts for connecting a surface mount component, such asdifferential and common mode filter 12, to the upper surface of carrier10, which in turn provides electrical connection between conductors 34and surface mount component 12. The surface mount components referredto, such as differential and common mode filter 12, are provided instandard surface mount packages which include a number of solderterminations for electrically coupling the device to external circuitryor in this case to carrier 10. Filter 12 includes first differentialelectrode band 28 and second differential electrode band 30 extendingfrom either end of filter 12.

[0059] Extending from the center of filter 12 is at least one and moretypically two, common ground conductive bands 26. An insulated outercasing 32 electrically isolates first and second differential electrodebands 28 and 30 and common ground conductive bands 26 from one another.A top plan view of a standard surface mount device as just described isshown in FIG. 20 as differential and common mode filter 104. The filter104 is comprised of first differential conductive band 116, seconddifferential conductive band 118 and two common ground conductive bands120. The insulated outer casing 122 separates and electrically isolateseach of the various conductive bands from one another.

[0060]FIG. 2 shows filter 12 positioned upon the top surface of carrier10 so that the common ground conductive bands 26 come in contact withthe portion of the metalized ground surface 16 which separates both ofthe insulating bands 22 from one another. This is accomplished bypositioning differential and common mode filter 12 lengthwise betweenthe two conductive pads 24 such that first differential electrode band28 is in contact with one of the two conductive pads 24 and seconddifferential electrode band 30 comes in contact with the otherconductive pad 24. Once filter 12 has been positioned, by default,insulated outer casing 32 of filter 12 aligns with portions ofinsulating bands 22 thereby maintaining electrical isolation between thevarious conductive and electrode bands of filter 12. First and seconddifferential conductive bands 28 and 30 and the common ground conductivebands 26 consist of solder terminations found in typical surface mountdevices. Once filter 12 is positioned upon carrier 10 standard solderreflow methods are employed causing the solder terminations to reflowthereby electrically coupling and physically bonding filter 12 tocarrier 10. Customary solder reflow methods which can be used includeinfrared radiation (IR), vapor phase and hot air ovens or any othermeans which can be used to expose the solder to sufficiently elevatedtemperatures.

[0061] Once differential and common mode surface mount filter 12 iscoupled to carrier 10, the combination of the two parts can bemanipulated, either manually or through various types of automatedequipment, without subjecting filter 12 to mechanical and physicalstresses normally associated with the handling of miniature and delicateelectronic components.

[0062] Once coupled to carrier 10, filter 12 is electrically connectedto external circuitry through conductors 34 which may consist of wireleads or lengths of flexible wire. Once disposed through apertures 18,conductors 34 are soldered to conductive pads 24 and within apertures18. Thru-hole plating 20 allows solder applied to conductive pads 24 andconductors 34 to flow into apertures 18 thereby adhering to thethru-hole plating.

[0063] Component carrier 10 reduces mechanical and physical stressessuch as shock, vibration and various thermal conditions which filter 12would otherwise be subjected to and provides a complete ground shieldfor filter 12. Because carrier 10 has a greater surface area then filter12 and a substantial portion of that surface area is covered bymetalized ground surface 16, carrier 10 acts as a ground shield whichabsorbs and dissipates electromagnetic interference and over voltages.These added benefits improve the overall functional performance andcharacteristics of filter 12.

[0064]FIGS. 4 and 5 illustrate a further alternate embodiment of thepresent invention, that being double-sided carrier 40. Carrier 40 isidentical to carrier 10, as shown in FIG. 2, except that carrier 40 isdouble-sided and as a bottom surface which is substantially identical tothe top surface. This configuration allows two differential and commonmode surface mount filters 12 a and 12 b to be mounted to the upper andlower surfaces of carrier 40. As illustrated in FIG. 4, metalized groundsurface 16 covers substantial portions of the top, sides and bottom ofcarrier 40 providing a greater overall surface area. The increasedsurface area of metalized ground surface 16 imparts greater shieldingcharacteristics in carrier 40 which absorb and dissipate electromagneticinterference. In addition, both the top and bottom of carrier 40 includecorresponding conductive pads 24 which are electrically connected to oneanother by thru-hole plating 20 which covers the inner walls ofapertures 18.

[0065] Double-sided carrier 40 is also advantageous in that it allowsfor flexibility needed to meet electromagnetic interference (EMI) andsurge protection requirements simultaneously through integration ofdifferent surface mount components on the same carrier substrate. As anexample, a differential and common mode filter. as previously described,could be coupled to the top of carrier 40 while a MOV device could becoupled on the bottom of carrier 40 effectively placing the filter andMOV devices in parallel to provide EMI and surge protection in onecompact, durable package. Because carrier 40 provides a rigid base formaintaining various electronic surface mount components, the componentsthemselves are subjected to less physical stress during manufacturingprocesses which in turn increases yields and lowers manufacturing costs.

[0066]FIG. 5 shows a modified configuration of metalized ground surface16. conductive pads 24 and insulating bands 22. In this alternativeembodiment, insulating bands 22 have been substantially increased suchthat the surface area of carrier 40 is substantially covered byinsulation as opposed to a metalized ground surface. This configurationcan be used when decreased shield characteristics are desired or theparticular interaction between carrier 40 and the surface mountcomponent needs to be precisely controlled.

[0067] One example is when parasitic capacitance values must bemaintained below a certain level. Note that the particular shapes ofinsulating bands 22, shown in FIG. 5, are not necessary. All that isrequired is that the surface area covered by metalized ground surface 16be varied which in turn varies the electrical characteristics ofdouble-sided carrier 40. It should also be noted that the surfacepattern shown in FIG. 3 can be used with the double-sided carrier 40,shown in FIG. 4, or the surface pattern shown in FIG. 5 could just aseasily be used with carrier 10, shown in FIG. 2. To obtain further ofcontrol the electrical characteristics of double-sided carrier 40, onesurface could be configured as shown in FIG. 5 while the other surface,either top or bottom, could be configured as shown in FIG. 3. Alteringthe upper and lower surface patterns of double-sided carrier 40depending upon the types of surface mount components coupled to carrier40 allows for obtaining optimal electrical characteristics as needed.

[0068]FIGS. 6 through 9 illustrate further alternate embodiments of thesingle and double sided carriers benefit to embedding conductive core 38within insulator 14 and electrically connecting conductive core 38 tometalized ground surface 16 is that a greater surface area is providedfor absorbing and dissipating electromagnetic interference and overvoltages without an increase in the overall dimensions of carrier 50.

[0069]FIGS. 8 and 9 disclose a further alternate embodiment of thepresent invention in double-sided carrier 60. Carrier 60 is identical tocarrier 50, shown in FIGS. 6 and 7, except that it is double-sided asthe embodiment shown in FIG. 4 with the addition of via 36 disposedthrough the bottom of carrier 60 electrically coupling metalized groundsurface 16 along the bottom of carrier 60 to conductive core 38. Thisembodiment provides a ground having an increased surface area to bothsurface mount differential and common mode filter components 12 a and 12b coupled to the top and bottom of double sided carrier 60.

[0070]FIGS. 10A and 10B show a further embodiment of the componentcarriers shown in FIGS. 2-9 configured to accept single and multiplesurface mount components and more specifically surface mountdifferential and common mode filters. As in the numerous embodimentsalready described, parallel component carrier 160 is a plate or disccomprised of insulating material 14, such as ceramic, having at leasttwo apertures 18.

[0071] Insulating material 14, also commonly referred to as a planarinsulator, is covered by conductive ground surface 16, at least twoconductive pads 24 surrounding apertures 18, and insulating bands 22surrounding each conductive pad 24. Insulating bands 22 separate andisolate conductive pads 24 from conductive ground surface 16. Theprimary difference between parallel component carrier 160 and thesurface mount component carriers previously described is the arrangementof conductive traces 156 extending from conductive pads 24. Eachconductive pad 24 includes two conductive traces 156 which extend fromone side of conductive pad 24 in a generally Y-shaped pattern therebyseparating each of the conductive traces 156 from one another. TheY-shaped patterns of conductive traces 156 are arranged on parallelcomponent carrier 160 so the distal ends of each conductive trace 156 isaligned with the distal end of an opposing conductive trace 156, eachextending from opposite conductive pads 24. In the parallel componentcarrier 160 embodiment insulating bands 22 surround not only conductivepads 24 but also extending conductive traces 156 of each conductive pad24 thereby electrically isolating conductive pads 24 and theirassociated conductive traces 156 from conductive ground surface 16.

[0072] Although not required, conductive ground surface 16 is configuredto cover as much area upon insulating material 14 as possible in orderto provide for maximum electrical shielding within a predetermined area.Due to the Y-configuration of conductive traces 156, conductive groundsurface 16 in the preferred embodiment encompasses a large rectangularportion between the opposing Y-configurations of conductive traces 156with smaller portions of conductive ground surface 16 extending betweenthe distal ends of opposing conductive traces 156.

[0073]FIG. 10B shows parallel component carrier 160 with differentialand common mode filter 500, as shown in FIG. 10C, coupled thereto. Thesurface mount differential and common mode filter 500 has its firstdifferential electrode bands 28 electrically coupled to the distal endof one conductive trace 156, its second differential electrode bands 30electrically coupled to the distal ends of the opposing conductive trace156 and its common ground conductive bands 26 electrically coupled tothe portion of conductive ground surface 16 which separates the distalends of the opposing conductive traces 156.

[0074] The electrical coupling of the various electrodes of differentialand common mode filter 500 is achieved through means well known in theart including but not limited to soldering. In operation, componentcarrier 160 receives electrical conductors (not shown) within apertures18, which are then electrically coupled to conductive pads 24 throughsoldering or other methods.

[0075] The multiple first and second electrode bands 28 and 30differential and common mode filter 500 are separated by common groundelectrode bands 26 and mounted on parallel component carrier 160. Thisconfiguration provides improved filtering and decoupling performancewhich results in a further reduction of equivalent series inductance(ESL) and equivalent series resistance (ESR). The inter-weavingarrangement of the first and second electrode bands 28 and 30 and thecommon ground electrode bands 26 optimizes the charge of differentialand common mode filter and decoupler 500.

[0076]FIG. 10D shows parallel component carrier 160 with twodifferential and common mode filters 12 coupled thereto. Each surfacemount differential and common mode filter 12 has its first differentialelectrode band 28 electrically coupled to the distal end of oneconductive trace 156, its second differential electrode band 30electrically coupled to the distal end of the opposing conductive trace156 and its common ground conductive bands 26 electrically coupled tothe portion of conductive ground surface 16 which separates the distalends of the opposing conductive traces 156. The electrical coupling ofthe various bands of differential and common mode filter 12 is achievedthrough means well known in the art including but not limited tosoldering. In operation, parallel component carrier 160 receiveselectrical conductors (not shown) within apertures 18, which are thenelectrically coupled to conductive pads 24 through soldering or othermethods.

[0077] The configuration of parallel component carrier 160 provideselectrical coupling between each electrical conductor (not shown)disposed within apertures 18 and the corresponding first and seconddifferential electrode bands 28 and 30 of differential and common modefilter 12 thereby providing coupling of the electrical conductors withtwo differential and common mode filters 12 connected in parallel. Theparallel differential and common mode filters 12 provide line-to-lineand line-to-ground filtering to the electrical conductors due to theirinternal architecture which provides for an inherent ground even in theabsence of conductive ground surface 16. Once the common groundconductive bands 26 of each filter 12 are electrically connected toconductive ground surface 16 the inherent ground characteristics offilter 12 increase substantially due to the expanded conductive surfacearea improving the electrical characteristics of both filters 12.Although not shown, it should be understood that parallel componentcarrier 160 can also be configured as a double-sided component carrieras disclosed in FIG. 4 thereby allowing it to accept four differentialand common mode filters 12 as opposed to only two as shown in FIG. 10D.It should also be understood that the invention is not limited to eithertwo or four differential and common mode filters 12. Multiple filters 12could be arranged on either side of parallel component carrier 160 in anarrangement similar to that described with the only limitation being thephysical space available which is dictated by the size of parallelcomponent carrier 160. It should also be understood that any of thevariations of parallel component carrier 160 can also include aconductive core coupled through vias to conductive ground surface 16similar to the arrangement shown in FIG. 8 and described previously.Such an arrangement, including an inner conductive core, provides evengreater surface area to the conductive ground surface further increasingthe electrical shielding and the overall performance characteristics ofthe differential and common mode filters 12 coupled to parallelcomponent carrier 160.

[0078] FIGS. 11-14 illustrate further alternate embodiments of thecomponent carriers of the present invention which receive a plurality ofdifferential and common mode filters 12 for use in connector andprototype assemblies. Referring to FIG. 11A, multi-chip componentcarrier 170 is shown which is configured for use in electricalconnectors such as D-sub connectors. As in previous embodiments of thepresent invention, multi-chip component carrier 170 is built uponinsulating material 172. Most of the surface area of component carrier170 consists of insulating material 172. FIGS. 11B and 11C, whichdisclose cross-sections of component carrier 170, show that ground layer174 is embedded within insulating material 172 and spans the majority ofthe area of component carrier 170. Ground layer 174 is conductive andtypically consists of a metallic material, although any type ofconductive matter could be substituted. In addition to ground layer 174being embedded within component carrier 170, the peripheral edges ofcomponent carrier 170 also include conductive surfaces 176 which areelectrically coupled to ground layer 174. The internal ground layer 174of component carrier 170 is also electrically connected to a pluralityof vias 182 which extend to conductive pads 180 formed on the surface ofcomponent carrier 170. As is well known in the art, vias 182 includeconductive plating which electrically connects conductive pads 180 toground layer 174, which in turn is electrically coupled to peripheralconductive surface 176. Also disposed in component carrier 170 are aplurality of feed-thru apertures 178 which are electrically isolatedfrom internal ground layer 174 by insulation 188. Formed around thevarious feed-thru apertures 178 are first and second electrode pads 184and 186. Each first electrode pad 184 is formed in a predeterminedposition in relation to a corresponding second electrode pad 186 whereinthe combination of first and second electrode pads 184 and 186 include avia 182 positioned there between.

[0079] As shown in FIG. 11A, the plurality of differential and commonmode filters 12 are positioned between the first and second electrodepads 184 and 186 in a lengthwise orientation such that firstdifferential electrode band 28 comes in contact with first electrode pad184 and a second differential electrode band 30 comes in contact withsecond electrode pad 186. Vias 182 are positioned between first andsecond electrode pads 184 and 186 so that conductive pads 180 of vias182 come in contact with common ground conductive bands 26 of thedifferential and common mode filters 12. The various conductive bands ofeach filter 12 are physically and electrically coupled to theirrespective conductive pads through soldering or other well known means.In operation, multi-chip component carrier 170 is placed over andreceives within its plurality of feed-thru apertures 178 male pins (notshown) associated with standard D-sub connector assemblies. Theplurality of pins are then electrically coupled to the plurality offirst and second electrode pads 184 and 186 through standard means. Inalternate embodiments feed-thru apertures 178 are plated with aconductive surface electrically connected to its associated first orsecond electrode pad 184 and 186 such that when the D-sub connectorassembly pins (not shown) are inserted within feed-thru apertures 178the physical contact between the pins and the conductive surfacesprovides the necessary electrical coupling.

[0080]FIG. 12 shows a further embodiment of the present inventionconsisting of a differential and common mode strip filter carrier 200.Differential and common mode strip filter 202 is disclosed in commonlyowned, application Ser. Nos. 08/841,940; 09/008,769; and 09/056,379,incorporated herein by reference. As in previous embodiments, stripfilter carrier 200 is constructed upon a plate or block of insulatingmaterial 216 and includes a plurality of feed-thru apertures 204 whichreceive male pins (not shown) from a connector assembly such as an RJ-45connector. Referring to FIG. 12A, the top surface of carrier 200includes conductive surface 210 running along the four edges of the topsurface with portions of conductive surface 210 extending inward in apredetermined pattern. Conductive surface 210 is electrically coupled toperipheral conductive surface 208 which surrounds the four sides ofcarrier 200, which is then electrically coupled to conductive surface206. Conductive surface 206 covers the majority of the area of thebottom surface of strip filter carrier 200 as shown in FIG. 12B.

[0081] Each feed through aperture 204, as shown in FIG. 12A, includes aconductive track extending from aperture 204 towards the center of stripfilter carrier 200 in a predetermined pattern. A portion of differentialand common mode strip filter 202 is shown positioned upon the topsurface of carrier 200 to demonstrate its coupling to strip filtercarrier 200. Common ground conductive band 218 of filter 202 comes incontact with conductive surface 210 that runs along the longitudinalends of strip filter carrier 200. The predetermined positioning of thefirst and second differential electrode bands 220 and 222 of filter 202align with their corresponding conductive tracks 226 and the commonground conductive bands 218 align with the inward extending conductivesurfaces 210. As described in the previous embodiments, the conductivebands are electrically connected to their corresponding conductivetracks and conductive surfaces through means including but not limitedto soldering. As shown in FIG. 12B, feed-thru apertures 204 aresurrounded by conductive bands 214 which, in turn, are then electricallyisolated from conductive surface 206 by insulation bands 212. As shownin FIG. 12C, a substantial area of conductive surface 206 iselectrically coupled through peripheral conductive surfaces 208 toconductive surface 210, which in turn is electrically coupled to commonground conductive band 218 of strip filter 202. This arrangementprovides for the increased shielding and improved electricalcharacteristics of differential and common mode strip filter 202previously described in relation to alternate embodiments of the presentinvention.

[0082] In use carrier 200 is placed over and receives within feed-thruapertures 204 a plurality of male pins (not shown) from a connectorassembly. Feed-thru apertures 204 include a conductive surface platingso that each conductive track 226 is electrically coupled to itscorresponding conductive band 214. Either through soldering or aconductive resistive fit, each male pin (not shown) is electricallycoupled to its corresponding first or second differential electrode band220 and 222 of differential and common mode strip filter 202.

[0083] FIGS. 13A-13C show a further alternate embodiment of the presentinvention.

[0084]FIGS. 13A and 13B disclose differential and common mode stripfilter carrier 230 having most of the top and bottom surface areacomposed of insulating material 216 with only a small border ofconductive surface 210 surrounding the outer edges of both the top andbottom surface of strip filter carrier 230. Conductive surface 210 alsosurrounds the sides of strip filter carrier 230 and electrically couplesto the conductive surface 210 running along the edges of both the topand bottom surfaces. Referring to FIG. 12A, conductive surface 210 alsoincludes portions which extend inward toward the center of the topsurface of strip filter carrier 230 in a predetermined pattern. Althoughnot shown, strip filter carrier 230 is configured to receivedifferential and common mode strip filter 202 as shown in FIG. 12A.

[0085] One difference in strip filter carrier 230 from component carrier200 as disclosed in FIGS. 12A-12C is that ground layer 234 is nowembedded within insulating material 216 and electrically coupled toconductive surfaces 210, which run along the sides of strip filtercarrier 230, and through vias 232. Ground layer 234 is also electricallycoupled to conductive surface 210 through vias 232 disposed within theinwardly extending portions of conductive surface 210 on the top surfaceof strip filter carrier 230. Again, strip filter carrier 230 includesfeed-thru apertures 204 having a conductive surface plating whichelectrically couples conductive tracks 226 on the top surface of stripfilter carrier 230 to conductive bands 214 on the bottom surface ofstrip filter carrier 230. Male pins (not shown) from a connectorassembly are received within feed-thru apertures 204 allowing forelectrical coupling to the various first and second differentialelectrode bands of differential and common mode strip filter 202 (notshown). As shown in FIG. 13C, each feed-thru aperture 204 is surroundedby insulation 224 electrically isolating the male pins inserted throughapertures 204 from the internal ground layer 234 of strip filter carrier230. FIGS. 11-13 demonstrate that a variety of component carrierconfigurations are contemplated by applicant which include embodimentsfor receiving different component packages for differential and commonmode filters. In addition, various configurations of the conductivesurface or ground layer are envisioned which provide for additionalelectrical shielding and substantially improve the electricalcharacteristics and performance of the differential and common modefilters attached to the carriers.

[0086] FIGS. 14A-14D illustrate a multi-component differential andcommon mode filter prototype carrier 240 which allows use of a pluralityof differential and common mode filters 12 in combination with thebenefits provided by the component carriers as described herein. At thesame time prototype carrier 240 allows for additional circuitry to becoupled to carrier 240 and filters 12 in a convenient and flexiblemanner allowing engineers to easily incorporate the technology describedinto a vast array of electronic products. Prototype carrier 240 isconstructed in a similar manner to that of the many previously describedembodiments. Prototype carrier 240 consists of a plate of insulatingmaterial 242 having predetermined configurations of conductive surface244 along its top and bottom surfaces and electrically interconnected byperipheral conductive surface 246 which surrounds the sides of prototypecarrier 240. Positioned upon both the top and bottom surfaces ofprototype carrier 240 are a plurality of smaller conductive surfaces 250which in turn are surrounded by insulating material 242 electricallyisolating conductive surfaces 250 from conductive surfaces 244.

[0087] As shown in FIG. 14A, differential and common mode filter 12 ispositioned lengthwise between two corresponding conductive surfaces 250such that first differential electrode band 28 comes into physicalcontact with one conductive surface 250, second differential electrodeband 30 comes in contact with a second and corresponding conductivesurface 250 and common ground conductive bands 26 come in physicalcontact with conductive surface 244 which separates the twocorresponding conductive surfaces 250. As in previous embodiments, thevarious bands of filter 12 are electrically coupled to their respectiveconductive surfaces through soldering and other common means. To providethe versatility required to interconnect additional electroniccomponents to prototype carrier 240 and differential and common modefilter 12, a plurality of apertures 248 are disposed within conductivesurfaces 250 and insulating material 242. To use prototype carrier 240various external electrical components or wires are disposed withinapertures 248 and then permanently connected through soldering or othermeans. Prototype carrier 240 is essentially a “bread board” whichelectrical engineers use to configure test circuits. Although not shown,it should be understood and applicant contemplates that the prototypecarrier 240 disclosed in FIGS. 14A-14D could be configured with aninternal ground layer electrically coupled to conductive surfaces 244through vias as disclosed previously in FIGS. 11 and 13. Thisarrangement would provide for greater effective surface area withincreased shielding effects.

[0088] Illustrated in FIGS. 15 through 18 is a further alternateembodiment of the component carriers of the present invention used toreceive and maintain a multiconductor thru-hole filter within amulti-conductor connector shell. Connector carrier 70, shown in FIGS. 15and 16, is comprised of wall 78 formed in the shape of a parallelogramor D-shape having a shelf 76 extending inward from wall 78 along thebottom of all four sides. Wall 78 includes a plurality of outwardlyextending protuberances 72 which act as spring or resistive fit contactsfor carrier 70 as will be further described. FIG. 17 shows a standardD-sub connector shell 74 which includes outwardly extending front wall88 shaped in the form of a parallelogram or D-shape. Shell 74 has ashelf 86 extending inwardly from the bottom of wall 88 which acts as astop and a mounting shelf for carrier 70.

[0089]FIG. 18 shows an exploded prospective view of D-sub connectorshell 74, connecter carrier 70 and multi-conductor differential andcommon mode filter 80. While carrier 70 can be used with a variety offilters, Applicant contemplates multi-conductor filter 80 being adifferential and common mode multi-conductor filter as disclosed inapplication Ser. Nos. 08/841,940; 09/008,769; and 09/056,379, previouslyincorporated herein by reference. Filter 80 includes a plurality ofapertures 84 which receive contact pins (not shown) associated with maleD-sub connectors commonly known in the art.

[0090] One example of such a connector is a male D-sub RS-232communications connector found in personal computers for couplingexternal devices such as modems to the computers. To be used in thisembodiment of carrier 70, filter 80 must also be formed in the shape ofa parallelogram or D-shape and have dimensions similar to those ofcarrier 70. Filter 80 includes plated surface 82 along its peripherywhich is electrically connected to the common ground conductive platesof filter 80. In use, conductor carrier 70 receives multi-conductorfilter 80 which abuts against inner shelf 76. Shelf 76 is coated with asolder reflow or an equivalent conductive surface so that once filter 80is inserted into carrier 70 and resting upon shelf 76, standard reflowmethods can be used to solder filter 80 within carrier 70. Such standardreflow methods include the use of infrared radiation (IR), vapor phaseand hot air ovens. The subassembly of filter 80 and carrier 70 is theninserted within D-sub connector shelf 74 so the subassembly is containedwithin wall 88 and abutted against shelf 86 which serves as a stop forcarrier 70. Connector carrier 70 is fabricated from a conductivematerial such as metal and, to obtain the full benefits of the presentinvention, D-sub connector shell 74 will also be fabricated from aconductive metallic material. The plurality of protuberances 72 providea resistive fit for carrier 70 against wall 88 of D-sub connector shelf74 which maintains carrier 70 within shell 74 and provides forelectrical conduction between plated surface 82 of filter 80 and shell74. As in previous embodiments, electrically coupling the groundconnection for multi-conductor filter 80 to carrier 70 and D-subconnector shell 74 increases the surface area provided for absorbing anddissipating electromagnetic interference and over voltages.

[0091] An additional embodiment of the present invention, connectorcarrier 100, is illustrated in FIG. 19. In this embodiment the surfacemount component carrier is directly incorporated within an electronicconnector. Connector carrier 100 is comprised of a metalized plasticbase 112 having a plurality of apertures 98 disposed through base 112,each of which receives a connector pin 102. Although not shown, portionsof each connector pin 102 extends through base 112 and out of the front110 of connector carrier 100. The portions of pins 102 extending fromthe front 110 of carrier 100 form a male connector which is then, inturn, received by a female connector as is known in the art.

[0092] The same configuration could be implemented on a female connectorwhich then receives male pins. Coupled to both edges of connectorcarrier 100, although only one edge is shown, is mounting base 114 whichelevates base 112 from a surface such as a printed circuit board. Theparticular embodiment of connector 100 shown in FIG. 19 is of a rightangle connector in which the tips of pins 102 would be inserted withinapertures in a printed circuit board. Pins 102 would then be soldered tothe individual apertures or pads in the printed circuit board to provideelectrical connection between pins 102 and any circuitry on the printedcircuit board. To provide for the coupling of a plurality ofdifferential and common mode filters 104 between the various connectorpins 102, two insulating bands 106 and 107 are provided to electricallyisolate each of the connector pins 102 from the metalized plastic base112 which covers substantially all of the surface area of connectorcarrier 100.

[0093] Referring to FIG. 20, the relationship between insulating bands106 and 107, metalized plastic base 112 and differential and common modefilter 104 will be explained in more detail. While only one example isshown, both insulating bands 106 and 107 include a plurality ofconductive pads 108 which surround apertures 98. Conductive pads 108 areelectrically coupled to connector pins 102 disposed through apertures98.

[0094] Insulating bands 106 and 107 provide a non-conductive barrierbetween the conductive pads 108 and the metalized plastic base 112.Surface mount components, such as differential and common mode filter104, are positioned between insulated bands 106 and 107 so that firstdifferential conductive band 116 of filter 104 comes in contact with aportion of a conductive pad 108 and second differential conductive band118 comes in contact with a portion of an opposite conductive pad 108.Insulated outer casing 122 of filter 104 slightly overlaps onto eachinsulating band 106 and 107 and metalized plastic base 112 to maintainelectrical isolation of first and second differential conductive bands116 and 118 and metalized plastic base 112 of connector carrier 100.Because metalized plastic base 112 runs between insulating bands 106 and107, common ground conductive bands 120 of filter 104 come in contactwith the metalized plastic base 112. As described earlier, each of thevarious conductive bands of filter 104 are comprised of solderterminations which, when subjected to known solder reflow methods,physically and electrically couple to any metallic surfaces which theycome in contact thereby permanently coupling the surface mountcomponents, i. e. filter 104, to connector carrier 100. As in theprevious embodiments, connector carrier 100 allows miniature, fragilesurface mount components to be used without subjecting those componentsto increased physical stress which can cause damage to the components,lowering production yields and increasing overall production costs.Metalized plastic base 112 also provides a large conductive surface areaconnected to the ground terminations of filter 104 improving the groundshield used to absorb and dissipate electromagnetic interference andover voltages.

[0095] As described herein with relation to each of the differential andcommon mode filter carrier embodiments, the primary advantages are theadditional physical strength the filter carriers provide to thedifferential and common mode filters and the increased shield and groundeffects provided by the enlarged conductive surface areas coupled to thedifferential and common mode filters. FIGS. 21A-21E show strain reliefcarrier 260 which provides these benefits to differential and commonmode filters configured with wire leads 266 as opposed to the varioussurface mount embodiments. Strain relief carrier 260 is comprised of aconductive material such a metal which is fabricated to create carrierframe 264. With reference to FIGS. 21B and 21C, strain relief carrier260 includes a horizontal component ledge 274 extending inward fromvertical wall 272 which completely surrounds and receives differentialand common mode filter 262. Extending from the upper end of verticalwall 272 is member 270 which extends outward to bend 276 with theremainder 278 of member 270 then directed back toward filter 262. In thepreferred embodiment, disclosed in FIG. 21D, strain relief carrier 260is formed of a single conductive material in which extended members 270,vertical walls 272 and component ledge 274 are formed throughpredetermined bends along the dashed lines. The overall metal carrierframe 264 provides differential and common mode filter 262 with theadditional physical strength and support that prevents filter 262 frombeing damaged in use. In addition, because strain relief carrier 260 isformed of a conductive material it carrier 290 is formed from a singlepiece of conductive material into two inverted and opposing U-shapes.

[0096] Differential and common mode filter 12 is received and maintainedupon base 292 and between inner protuberance 294 and outer protuberance296 which provide a tight, resistive fitting for filter 12. Theresistive fitting also forces electrical contact between base 292 andcommon ground conductive bands 26 of filter 12 as shown in FIG. 22B.Referring to FIG. 23, ground strap carrier 290 and differential andcommon mode filter 12 are coupled to electric motor housing 304 by hook308. Hook 308 is comprised of vertical member 298, top 300 and verticalmember 302 as shown in FIGS. 22A and 22B. Because ground strap carrier290 is formed of a conductive material, when it is coupled to anelectrical motor, the conductive motor housing 304 provides an enhancedshielding and ground surface area for differential and common modefilter 12 which enhances its shielding and electrical characteristics.Referring to FIG. 23, the first and second differential electrode bands28 and 30 of differential and common mode filter 12 are electricallyconnected to the motor through spring retention conductors 306 formedwithin the motor and weaved around motor components 310. FIGS. 22C and22D disclose an alternate embodiment of ground strap carrier 290 inwhich base 292 is elongated such that filter 12 can be accepted withincarrier 290 in a flat orientation. The flat orientation allows bothcommon ground conductive bands 26 of filter 12 to come in contact withprotuberances 294 and 296. Ground strap carrier 290 provides a means forcoupling surface mount differential and common mode filters withinelectric motors despite the small size and fragile nature of surfacemount differential and common mode filters.

[0097] FIGS. 24A-24C show a further embodiment of the present inventionas motor filter carrier 320. As in previous embodiments, motor filtercarrier 320 is constructed on a base of insulating material 326, asshown in FIG. 24B, which can be formed into any shape but in thepreferred embodiment is circular to match the shape of most electricmotors. Motor filter carrier 320 includes conductive surface 328 whichcovers most of the top and bottom surfaces of motor filter carrier 320.Electrically coupling the top and bottom conductive surfaces 328 isperipheral conductive surface 330 which surrounds the sides of motorfilter carrier 320 to substantially cover the outer surfaces of motorfilter carrier 320 with a conductive ground surface. Disposed throughthe center of motor filter carrier 320 is aperture 322 which receives arotor (not shown) of an electric motor.

[0098] Surrounding aperture 322 is insulation 332 which preventselectrical connection between motor filter carrier 320 and the rotor ofthe electric motor. Motor filter carrier 320 also includes a pluralityof mounting apertures 344 which receive mounting hardware, such asscrews, used to physically connect motor filter carrier 320 onto anelectric motor.

[0099] Referring to FIG. 24A, motor filter carrier 320 includes threeconductive apertures 342 which receive corresponding pins 316 fromelectrical connector 334. Attached and electrically coupled to each pad342 is a conductive track 340 which extends from pad 342 towards thecenter of motor filter carrier 320. The three conductive tracks 340 arearranged in parallel to receive surface mount differential and commonmode filter 12A.

[0100] The two outer conductive tracks 340 have insulating material 326surrounding the conductive track 340 in order to isolate the first andsecond differential electrode bands 28 and 30 of filter 12A fromeverything except their associated conductive tracks 340. The centerconductive track 340 is electrically coupled to conductive surface 328of motor filter carrier 320 which, in turn, electrically couples commonground conductive bands 26 of filter 12A to conductive surface 328 ofmotor filter carrier 320. Through this arrangement surface mountdifferential and common mode filter 12A is physically mounted to the topsurface of motor filter carrier 320 with each of its bands electricallyconnected to each of the conductors 316 of electrical connector 334. Thecenter pin 316 of electrical connector 334 is electrically coupled tothe top and bottom surfaces by feedthru aperture 338 which is platedwith a conductive surface or through a direct connection using a metallead (not shown).

[0101] Referring to FIG. 24C, the bottom surface of motor filter carrier320 includes a similar arrangement of conductive tracks 340 andconductive pads 342 which receive a second surface mount differentialand common mode filter 12B. Differential and common mode filters 12A and12B are electrically connected in parallel by a plurality of feed-thruapertures 338 shown in FIG. 24B or by connector pins directly. Each ofthe connector pins 316 of electrical connector 334 are disposed withinfeed-thru apertures 338 and electrically connected to a conductive pad342 on both the top and bottom surfaces of motor filter carrier 320. Thedescribed arrangement allows parallel coupling of surface mountdifferential and common mode filters 12A and 12B which allows both lowand high frequency filters to be combined in parallel to electricallycondition an electrical motor coupled to motor filter carrier 320. Thebottom surface of motor filter carrier 320, shown in FIG. 24C, differsfrom the top surface in that it includes an enlarged portion ofinsulating material 326 which electrically isolates two of the threeelectrical motor brushes 324 from conductive surface 328. The embodimentof the present invention disclosed in FIGS. 24A-24C is configured foruse with a three brush electric motor with motor filter carrier 320replacing a conventional cover of an electric motor. The three brushes324 come in contact with the bottom surface of motor filter carrier 320when carrier 320 is coupled to an electrical motor (not shown). As thethree bushes 324 are the portions of the electric motor to receive thedifferential and common mode filter, the bottom surface of motor filtercarrier 320 provides electrical coupling to surface mount differentialand common mode filters 12A and 12B. One of three brushes 324 iselectrically coupled to conductive surface 328 by flexible wire braid356 connected to feed-thru brush aperture 318 and the nearest associatedelectrical motor brush 324. To electrically connect the remaining twobrushes 324 to the first and second differential electrode bands 28 and30 of filters 12A and 12B, brush contacts 354 comprised of conductivetracks extending from conductive tracks 340 come into physical contactwith their respective brushes 324.

[0102] Motor filter carrier 320 when coupled with one or moredifferential and common mode filters 12A and/or 12B prevents electricfields generated within the motor, both low and high frequency, fromcoupling to wires, leads or traces which act as an antennas dispersingelectrical noise throughout an electrical system. The present inventionreplaces known technology which required multiple capacitors, inductorsand related circuits in addition to a shield or a protective shellenclosing the motor. Motor filter carrier 320 is particularlyadvantageous because many smaller electric motors have a plastic ornonmetallic top which allows electrical noise generated within the motorhousing to escape or be transmitted out of the motor where it caninterfere with other electrical systems. When motor filter carrier 320,in conjunction with one or more differential and common mode filters 12,is connected to a conductive enclosure of an electric motor thecombination prevents internally generated electrical noise fromescaping.The stray electrical noise is then disposed of by shunting the noise tothe conductive motor housing ground connection. The present inventionprovides a low cost, simple assembly which requires less volume andprovides for high temperature EMI performance in one package.

[0103] FIGS. 25A-25D show a further alternate embodiment of the presentinvention as motor filter carrier 350. The primarydifferences of thepresent embodiment to that disclosed in FIG. 24 is that the top andbottom surfaces of motor filter carrier 350 are comprised of insulatingmaterial 326 as opposed to a conductive surface. The top surface ofmotor filter carrier 350, shown in FIG. 25C, is essentially identical tothe top surface described with respect to FIG. 24A except that most ofthe top surface is comprised of insulating material 326. The bottomsurface of motor filter carrier 350, shown in FIG. 25A, is alsosubstantially similar to the bottom surface described with respect toFIG. 24C except that most of the bottom surface is comprised ofinsulating material 326. There are also several other differences whichwill now be described. Referring to FIG. 25A, the bottom surfaceincludes two conductive tracks 340 which are electrically coupled toconductors 316 of electrical connector 334. Electrically coupling eachconductive track 340 to its respective electric motor brush 324 areflexible wire braids 348. In order to achieve the improved shielding andground benefits, motor filter carrier 350 includes conductive core 346spanning the circular area of motor filter carrier 350 while beingembedded within top and bottom layers of insulating material 326.Referring to FIG. 25B, each of the plurality of mounting apertures 344include conductive surfaces 352 which are electrically coupled toconductive core 346. When motor filter carrier 350 is placed over oneend of an electric motor (not shown) with the rotor being disposedwithin aperture 322, the electrical coupling of the conductive housingof the electric motor with conductive core 346 of motor filter carrier350 is achieved through the use of conductive mounting hardware such asmetal screws. The conductive hardware is used to complete an electriccircuit or loop between the motor housing mounting apertures 344 andconductive core 346. It can be seen from FIG. 25D that middle conductivepin 316 of connector 334 only extends within motor filter carrier 350until it comes in contact with conductive core 346 providing electricalcoupling between conductive core 346 and common ground conductive bands26 of surface mount differential and common mode filter 12. Shown inFIG. 25B, the remaining conductive pins 316 attached to electricalconnector 334 extend through the entire width of motor filter carrier350 to electrically couple first and second differential electrode bands28 and 30 to their respective electrical motor brushes 324 usingflexible wire braids 348. Although this particular embodiment does notdisclose the use of a second surface mount differential and common modefilter connected to the bottom of motor filter carrier 350, such analternate embodiment is contemplated by applicant. For the same reasonsapplicant also contemplates motor filter carrier 320 shown in FIGS.24A-24C only having a single differential and common mode filter.

[0104] A third alternate embodiment of the motor filter carriers of thepresent invention is disclosed in FIGS. 26A-26F as motor filter carrier370. This embodiment provides the added benefit of having surface mountdifferential and common mode filter 12 embedded within motor filtercarrier 370 thus providing a single component for use in providingdifferential and common mode filtering and ground shielding to electricmotors. As in previous embodiments, motor filter carrier 370 includes anelectrical connector 334 coupled to the top surface of motor filtercarrier 370 with the top surface covered by conductive surface 328.Motor filter carrier 370 also includes a plurality of mounting apertures344 and aperture 322 disposed through motor filter carrier 370. Aperture322 is electrically isolated from conductive surface 328 by insulation322. The bottom surface of motor filter carrier 370, as shown in FIG.26C, is also covered by conductive surface 328 which is electricallyconnected to conductive surface 328 on the top of motor filter carrier370 by peripheral conductive surface 330 surrounding the sides of motorfilter carrier 370. As in the previous embodiments, electric motorbrushes 324 come in connect with the bottom surface of motor filtercarrier 370 and are electrically coupled to surface mount differentialand common mode filter 12 by flexible wire braids 348. The centraldifference of the present embodiment is the inclusion of internal layer360 to which surface mount differential and common mode filter 12 isphysically coupled. Internal layer 360 is comprised of insulatingmaterial 326 and includes a plurality of conductive tracks deposited onthe surface of internal layer 360 used to electrically couple thevarious bands of differential and common mode filter 12 to electricmotor brushes 324. Referred to FIG. 26E, internal layer 360 includesfirst conductive track 372, second conductive track 374 and groundconductive track 376. Each conductive track is electrically coupled toone of the conductive pins 316 extending from electrical connector 334.Surface mount differential and common mode filter 12 is placed on top ofinternal layer 360 in a predetermined position such that conductivetrack 372 is electrically coupled to second differential electrode band30 and conductive track 374 is electrically connected to firstdifferential electrode band 28. Conductive track 376 comes in contactwith and is electrically coupled to common ground conductive bands 26 offilter 12. Each of the conductive tracks, 372, 374 and 376, come incontact with and surround one or more feed-thru apertures 338 whichprovide electrical coupling to the plurality of brushes 324.

[0105] Each of the feed-thru apertures 338 are covered with a conductivesurface so flexible wire braid 348 connects brushes 324 to filter 12when soldered within feed-thru apertures 338.

[0106] Although not shown, the present embodiment could be combined withthe previous motor filter carrier embodiments in any number ofcombinations including having surface mount differential and common modefilters coupled to an internal layer and both top and bottom surfacesthereby providing even more versatility and filtering capability FIGS.27A and 27B show the carrier electrical circuit conditioning assembly400 which resulted from the combination of the previously describedcomponent carriers with the differential and common mode filter 12.Shown in FIG. 27A, differential and common mode filter 12 is placed uponconductive ground surface 402 making physical contact between conductiveground surface 402 and common ground conductive electrode bands 26.First and second differential conductive bands 30 and 28 are placed uponinsulation pads 408 with differential signal conductors 404 and 406disposed through each insulation pad 408. First differential electrodeband 28 and first differential signal conductor 404 are then furthercoupled physically and electrically to each other through a well knownmeans in the art such as solder 410. In addition, second differentialelectrode band 30 and second differential signal conductor 406 arecoupled physically and electrically to one another and common groundconductive electrode bands 26 are coupled physically and electrically toground area 402.

[0107] The internal construction of differential and common mode filter12 electrically isolates differential signal conductor 404 and firstdifferential electrode band 28 from second differential signal conductor406 and second differential electrode band 30. The internal constructionof the differential and common mode filter 12 creates a capacitiveelement coupled between the first and second differential signalconductors 404 and 406 and creates two capacitive elements, one coupledbetween the first differential signal conductor 404 and the commonconductive ground surface 402 and the other coupled between the othersecond differential signal conductor 406 and the common conductiveground surface 402. While this arrangement of line-to-line andline-to-ground filtering is occurring the first and second differentialsignal conductors 404 and 406 remain electrically isolated from oneanother.

[0108] From FIG. 27B it can be seen that first and second differentialelectrode bands 28 and 30 are prevented from coming into direct physicalcontact with conductive ground surface 402 due to insulating pads 408interposed between differential signal conductors 404 and 406 and theconductive ground surface 402.

[0109] The combination of the differential and common mode filter 12with its capacitive elements coupled line-to-line between differentialsignal conductors 404 and 406 and line-toground between the differentialsignal conductors 404 and 406 and conductive ground surface 402 providessubstantial attenuation and filtering of differential and common modeelectrical noise. At the same time the combination also performssimultaneous differential line decoupling. Another benefit provided bythe combination include mutual cancellation of magnetic fields generatedbetween differential signal conductors 404 and 406. By connecting thecommon ground conductive electrode bands 26 to a large conductive groundsurface 402, increased shielding of the ground plane is provided todifferential and common mode filter 12 which further enhances thedesired functional characteristics of differential and common modefilter 12.

[0110] The combination of the differential and common mode filter 12with the internal partial Faraday-like shields electrically connected toconductive ground surface 402 cause noise and coupling currents fromdifferent elements of carrier electrical circuit conditioning assembly400 to be contained at their source or to conductive ground surface 402without affecting differential signal conductors 404 and 406 or otherelements of carrier electrical circuit conditioning assembly 400 whendifferential and common mode filter 12 is attached between differentialsignal conductors 404 and 406. Carrier electrical circuit conditioningassembly 400 reduces, and in some cases eliminates, forms of capacitorparasitics and stray capacitance between differential signal conductors404 and 406. Differential and common mode filter 12 provides thesebenefits due to its internal, partial Faraday-like shields that almostenvelope the internal differential electrodes of differential and commonmode filter 12 which connect to ground conductive electrode bands 26.These benefits are significantly increased when the partial Faraday-likeshields are electrically connected by ground conductive electrode bands26 to conductive ground surface 402.

[0111] FIGS. 28A-28D show one application of carrier electrical circuitconditioning assembly 400 used in conjunction with a crystal. Referringto FIG. 28B, differential and common mode filter 12 is physically andelectrically coupled between first and second differential signalconductors 404 and 406 and to ground conductive surface 402. In thisparticular application ground conductive surface 402 is comprised of themetal base of the crystal, which in turn is connected to a metal cover415 shown in FIGS. 28C and 28D. First and second differential signalconductors 404 and 406 of carrier electrical circuit conditioningassembly 400 are electrically isolated from ground conductive surface402 by insulation pads 408. Common ground conductive electrode bands 26are electrically connected to ground conductive surface 402 using solder410 or other similar means. A ground conductor pin 414 is also attachedor molded monolithically to conductive ground surface 402 by soldering,welding or casting. Ground conductor pin 414 allows for furtherconnection of crystal component application 416 to a system ground (notshown). The internal construction of the differential and common modefilter 12 creates a capacitive element coupled between the first andsecond differential signal conductors 404 and 406 and creates twocapacitive elements, one coupled between the first differential signalconductor 404 and ground conductive surface 402 and the other coupledbetween the other second differential signal conductor 406 and groundconductive surface 402. While this arrangement of line-to-line andline-to-ground filtering is occurring the first and second differentialsignal conductors 404 and 406 remain electrically isolated from oneanother. From FIG. 28B it can be seen that first and second differentialelectrode bands 28 and 30 are prevented from coming into direct physicalcontact with ground conductive surface 402 due to insulating pads 408interposed between differential signal conductors 404 and 406 and theground conductive surface 402.

[0112]FIGS. 28C and 28D show the final combination of crystal componentassembly 416 and its metal housing 415 which provides an additionalground shield for the combination.

[0113] The carrier electrical circuit conditioning assembly 400 shown incrystal component assembly 416 simultaneously filters and attenuatescommon mode and differential mode electrical noise attributed to suchcircuitry including such noise found between differential electricalline conductors 404 and 406. Crystal component assembly 416 can alsosubstantially reduce and in some cases eliminate or prevent differentialcurrent flow, mutual inductive coupling such as cross talk and groundbounce between either differential electrical line conductor 404 and406. The carrier electrical circuit conditioning assembly 400 alsosimultaneously provides mutual cancellation of opposing magnetic fieldsattributed to and existing between differential electrical lineconductors 404 and 406. In addition, carrier electrical circuitconditioning assembly 400 complements the inherent, internal groundstructure and internal shield structures that nearly envelope orsurround each opposing electrode within differential and common modefilter 12 to substantially improve overall noise attenuation ondifferential signal conductors 404 and 406 that would otherwise affectand degrade the desired performance of crystal component application416. The essential elements of carrier electrical circuit conditioningassembly 400 consist of differential and common mode filter anddecoupler 12 as defined herein with a capacitive element coupled betweenthe first and second differential signal conductors 404 and 406 and twocapacitive elements, one coupled between the first differential signalconductor 404 and ground conductive surface 402 and the other coupledbetween the other second differential signal conductor 406 and groundconductive surface 402 while maintaining electrical isolation betweenthe first and second differential signal conductors 404 and 406; atleast two energized differential electrical line conductors; and aphysical and electrical coupling of common ground conductive electrodebands 26 of differential and common mode filter 12 to ground conductivesurface 402. The various elements listed that make up carrier electricalcircuit conditioning assembly 400 are interconnected using solder 410,conductive epoxy 417 or other means well known in the art.

[0114] Although the principles, preferred embodiments and preferredoperation of the present invention have been described in detail herein,this is not to be construed as being limited to the particularillustrative forms disclosed. They will thus become apparent to thoseskilled in the art that various modifications of the preferredembodiments herein can be made without departing from the spirit orscope of the invention as defined by the appended claims. The numeralsin claims 1-18 presented below refer to the elements in figures in U.S.patent application publication No. 2003/0048029, which is incorporatedherein by reference. Claims 1-18 are copied from U.S. patent applicationpublication No. 2003/0048029 herein for purposes of interference.

1. Filtering and interference suppression device (62), particularly ofthe broad band type, for an electric motor (34) comprising at least afirst powering brush (16) for an armature commutator of the electricmotor (34), of the type comprising a capacitor (64), one terminal ofwhich is electrically connected to a strip conductor (38) thatelectrically powers the first brush (16) powering the armaturecommutator of the electric motor (34), and the other terminal of whichis electrically connected to a ground strip conductor (58), connected,in turn, to the electrical ground (60) of the electric motor (34),characterized in that the capacitor (72) of the filtering andinterference suppression device (62) is of the non-inductive type, andin that each of the non-inductive capacitors (72) is directly attachedto a circuit board (73) comprising strip conductors, of which are atleast one powering strip conductor (38, 40) for a brush and one groundstrip conductor (58).
 2. Filtering and interference suppression device(62) for an electric motor (34) according to the preceding claim,characterized in that it comprises at least a first (16) and secondpowering brush (18) for the armature commutator, each of which isconnected to the electrical ground (60) of the motor (34), withinterposition of a capacitor (72), one terminal (74, 76) of which isconnected to a strip conductor (38, 40) electrically powering thecorresponding brush (16, 18), and the other ground terminal (78, 80) ofwhich is connected to the ground (60), and in that each capacitor (72)is a capacitor (72) of the non-inductive type.
 3. Filtering andinterference suppression device (62) according to the preceding claim,characterized in that the two filtering and interference suppressingcapacitors (72) of the non-inductive type are made in the form of adouble non-inductive capacitor (72).
 4. Filtering and interferencesuppression device (62) according to any of the preceding claims,characterized in that the circuit board (73) is the brush-bearing board(10) for the electric motor (34).
 5. Filtering and interferencesuppression device (62) according to any of the preceding claims,characterized in that each non-inductive filtering and interferencesuppressing capacitor (72) is of the CMS type.
 6. Filtering andinterference suppression device (62) according to any of the precedingclaims, characterized in that the electric terminals (74, 76, 78, 80) ofeach non-inductive capacitor (72) are electrically connected anddirectly attached to the corresponding strip conductors (38, 40, 58). 7.Filtering and interference suppression device (62) according to thepreceding claim, characterized in that each terminal (74, 76, 78, 80) isattached and electrically connected to the corresponding strip bysoldering.
 8. Filtering and interference suppression device (62)according to claim 6 or 7, characterized in that each terminal (74, 76,78, 80) is attached and electrically connected to the correspondingstrip (38, 40, 58) by gluing with a conductive glue.
 9. Filtering andinterference suppression device (62) according to any of the precedingclaims, characterized in that it comprises at least one other capacitor(82, 84) interposed between the ground strip (58) and one section of thepower strip (38, 40) for at least one of the brushes (16, 18) poweringthe armature commutator of the electric motor (34) which is locatedbetween the non-inductive capacitor (72) and the corresponding brush(16, 18).
 10. Filtering and interference suppression device (62)according to the preceding claim, characterized in that at least one ofthe other capacitors (82, 84) is of the CMS type.
 11. Filtering andinterference suppression device (62) according to any of the precedingclaims, characterized in that the section of at least one of the powerstrips (38, 40) for one of the brushes (16, 18) powering the commutator,which is located between the non-inductive capacitor (72) and thecorresponding brush (16, 18), comprises a choke (86, 88) connected inseries.
 12. Filtering and interference suppression device (62) accordingto any of the preceding claims, characterized in that it comprises achoke connected in series on the ground strip (58) between one groundterminal (78, 80) of the non-inductive capacitor (72) and the brush(20).
 13. Filtering and interference suppression device (62) accordingto claim 11 or 12, characterized in that at least one of the chokes (86,88) is of the high-frequency type.
 14. Filtering and interferencesuppression device (62) according to any of claims 11 to 13,characterized in that at least one of the chokes (86, 88) is coiled, andin that it comprises at least one space that separates two juxtaposedturns.
 15. Filtering and interference suppression device (62) accordingto any of claims 11 to 14, characterized in that at least one of thechokes (86, 88) is of the CMS type.
 16. Filtering and interferencesuppression device (62) according to any of the preceding claims,characterized in that it comprises thermal protector (90) located on theground strip (58).
 17. Filtering and interference suppression device(62) according to any of claims 9 to 16, characterized in that itcomprises at least one peak-limiter connected in parallel with thenon-inductive capacitor (72), between the ground strip (58) and one ofthe strip conductors (38, 40).
 18. Filtering and interferencesuppression device (62) according to the preceding claim, characterizedin that at least one of the peak-limiters is of the CMS type.